2008, Vol.11, No.3, pp.299-315
In this paper, we present the set of comprehensive mathematical models
and numerical techniques to simulate the formation, evolution and
interaction of point defects that determine the anomalous dopant diffusion
in silicon. These models allow to simulate extended defect
kinetics and transient enhanced diffusion (TED) of impurities during
past implant treatment of semiconductor wafers. The numerical implementation is
based on suitable combination of classical continuum methods in TCAD
modeling and new algorithms introduced to solve the large
sets of coupled differential equations.
Several computational examples are presented and discussed.
Key words:
numerical methods, finite difference scheme, point defect engineering,
shallow junction, low temperature annealing
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